Research On Key Process Technologies For Miniaturization And Micro-assembly Of A Power Module

Today's aerospace and military electronics are moving toward miniaturization,lightweight and integration.Aiming at the higher requirements of a certain type of power module in aerospace,such as volume,weight,power density,reliability and so on,the power module must be micro-assembled and reformed.This paper takes the traditional assembly power module as the research object,according to the characteristics of a model power supply module,combined with micro-assembly process technology,from the circuit design and process point of view to establish a suitable miniaturization program;By studying the different working mechanism of plasma cleaning,the cleaning gas suitable for the reforming of this type of product and the cleaning process parameters suitable for the cleaning of gold-plated ceramic plates were determined.By studying the composition and conducting mechanism of conductive glue,H20 E conductive plastic,to determine the qualified bonding parameters to ensure that the chip bonding accuracy,high strength;Using the bonding mechanism of gold wire,the key points of bonding quality control were determined.The influence of the key parameters on the bonding quality was explored by single factor iteration method.The optimal parameters were screened and the tensile force was verified.Using the orthogonal experiment idea to test the combination of different bonding process parameters,the optimal bonding parameters were obtained.Through the research on the principle of laser sealing,the assembly method of the shell and the cover is redesigned,the suitable assembly clearance for the laser source used is determined,the key process parameters influencing the welding of kovar material are determined,Adverse phenomena occurred during the welding process were analyzed,and the resulting package case meets airtight requirements of the standard.The research results of key technology is utilized to assemble the reorganization module.The reformation module meets the technical requirements of the original power module,passes the reliability verification test,achieves the goal of reducing the volume and the mass by 10%,and verify the feasibility of reforming miniaturization of power modules.