CCGA Assembly Technology Research In Aerospace Products

With the development of science and technology, electronics are becoming more and more multi-function, miniaturization, high density, high reliable. In order to adapt to the high reliable application environment, BGA developed to ceramic package from plastic package. To decrease the thermal fatigue damage from the mismatch of coefficient of thermal expansion between the substrate and the circuit board, BGA became to CCGA having higher thermal reliability. It is studied on the high reliability of CCGA device installed technology in the paper to meet the application requirements of aerospace products.Recolumn and PCB assembly are significant in CCGA assembly technique. In this paper, CCGA assembly is researched through test, including recolumn methods and parameters, quantity of solder paste printing, placement parameters, reflow soldering process and temperature parameters, cleaning, etal. First, completing PCB assembly process under different quantity of the solder paste parameters and temperature. And then, the test circuit boards are experienced temperature cycling and vibration environment experiment. Finally, solder joint appearance and IMC are analyzed through the optical microscope, X-Ray detector, metallographic microscope, SEM. In addition, the finite element analysis is utilized to simulate the stress and deformation distribution of PCBA and CCGA under temperature cycling and vibration loading, and compared with the test results.The results show that recolumn process and reflow soldering process are feasible, that the CCGA package has higher reliability and is more preferable than CBGA in harsh environment; The research on assembly of CCGA package can make it work in high reliable condition.