Research On Welding Technology Of CCGA Packaged Devices

The rapid development of modern electronic information technology.The miniaturization,high speed and high reliability of electronic systems require electronic components to shift toward miniaturization and integration.At the same time,new packaging technologies are constantly emerging and developing.This trend is This is especially noticeable on logic and microprocessors.CCGA packaging has higher thermal reliability.In order to meet the requirements of aerospace product applications,the paper studies the soldering process of CCGA packaging devices.This article uses a combination of experiments and simulations to explore and study the process parameters and processes of the CCGA assembly process.Its research content mainly includes solder paste printing process,reflow curve setting,reinforcement process and solder joint reliability analysis.At the same time,the VS8 optical stereo microscope,X-Ray inspection instrument,metallographic microscope,scanning electron microscope and other equipment were used to observe and analyze the wetting of the solder joints and the IMC thickness between the solder and the substrate,and the CCGA using ANSYS software Welding joints were subjected to finite element simulation,the stress distribution of the joints under temperature load was analyzed,and the thermal fatigue life prediction of the key joints in the model was performed.The reliability of the welding process was verified by a combination of simulation and experiment.Research shows that after welding is completed,the void ratio of the solder joint is not more than 15%,and the IMC thickness of the solder joint meets 0.5 μm to 4 μm.Its welding process meets the technological requirements of aerospace electronic products.