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Investigation Of E-Band High Efficiency Plate Array Antenna Using Diffusion Bonding Techniques

Posted on:2019-02-11Degree:MasterType:Thesis
Country:ChinaCandidate:B C WangFull Text:PDF
GTID:2348330569987771Subject:Electromagnetic field and microwave technology
Abstract/Summary:PDF Full Text Request
With the increase of modern communication data rate,the shortage of wireless spectrum is a real and growing problem,especially for the lower microwave frequency band.Therefore,people’s attention turn to higher band,like E-band.E-band has been allocated for point-to-point communication and next generation back-haul system.Therefore,it is greatly necessary to develop high-efficiency high-gain wideband plate array antenna.After comparing many types of antenna elements,four-ridge waveguide horn is chosen as radiating element.The rectangular waveguide is chosen as feeding transmission line.After that,many sorts of power divider are developed by full-wave analysis and mode-matching method,etc.Cascaded power dividers are used to design feeding network with good performance.Then,16×16 plate array is fabricated by diffusion bonding of thin copper plate.Within the frequency band from 70 GHz to 87 GHz,the measured gain is over 29.5 dBi,the total efficiency is over 50% and the cross-polarization level is less than-40 dB.On this basis,the height of feeding waveguide is reduced and folded feeding network is adopted to design 32×32 array.The effects of fillet and machining error are considered in the 32×32 array design.Within the frequency band from 75 GHz to 88 GHz,the measured gain is over 32 dBi and the cross-polarization level is less than-40 dB.
Keywords/Search Tags:E-band, plate array antenna, power divider, feeding network
PDF Full Text Request
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