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Research On The 3D Printed Microchannel Heat Dissipation And Its Network Data Management Platform

Posted on:2019-05-03Degree:MasterType:Thesis
Country:ChinaCandidate:S YaoFull Text:PDF
GTID:2348330563454090Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
At the moment of rapid development of Electronic Science and technology,the power density of electronic devices is increasing,and the system structure is becoming more and more compact.This will inevitably have higher heat dissipation requirements for electronic devices.Therefore,it is necessary to study and design a more efficient,more stable,more powerful heat dissipation device.In this paper,based on the common microchannel structure,a new type of rhombus cross arrangement of the flow channel heat dissipation structure is designed.According to the Murray law,the pipe diameter ratio of the runner is designed,and the thermodynamic simulation of multiple shunting angles is carried out by Fluent software,and the most suitable diversion angle is chosen.In theory,each channel staggered structure makes the micro channel in exchange,greatly reducing the liquid entrance flow pressure,staggered way can not only make the coolant flow average pressure,can also further increase the internal cooling area,improve the micro channel heat transfer efficiency.Then,through Solidworks and Fluent software,the structure is modeled and simulated,and the heat transfer characteristics and flow characteristics are analyzed based on the simulation data.This paper is not limited to the theoretical analysis of the new microchannel structure,and will also produce the material of this structure and further analyze its heat dissipation characteristics.However,because the traditional and mechanical technology is difficult to process the complex structure and hollow micro channel structure.Therefore,through the introduction and analysis of 3D printing technology,the physical model is printed through SLS technology,and its accuracy is analyzed.Then the experimental platform of micro channel heat dissipation is set up.The heat source of different power is simulated by adjusting the voltage of the radiator.A series of experiments have been carried out on this model.Through the analysis of the experimental data and theoretical data,the heat transfer characteristics of the structure are demonstrated,and the reasons for the two small errors are also pointed out.During the digital simulation of the microchannel structure and the statistics of the experimental data,i have encountered some problems,such as chaotic recording format,difficulty in viewing and complicated charts,which are very disadvantageous to the research and analysis of data.And when collaborating with other researchers,they oftenencounter data loss,borrowing difficulties and inconvenient collaboration.This phenomenon leads to the author's continuous thinking on the data problem in the field of microchannel heat dissipation.If we want to solve the above problems and improve the efficiency of scientific research,it is necessary to study and develop a network data management platform.In addition,digital digital management software has not appeared in the field of microchannel heat dissipation.Therefore,the detailed requirement analysis and system design are carried out on the basis of the theory base of data platform development.In the field of heat dissipation,scientific research and efficiency enhancement are of great significance.
Keywords/Search Tags:Microchannel radiator, 3D printing, fork row structure, data platform
PDF Full Text Request
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