Research On Place And Route Benchmark For 3D IC

With the increase of the scale of integrated circuit,the design and manufacture of integrated circuit technology is also in constant development,and the technology has reached the physical limit.3D integrated circuit is one of the most possible way to break through the bottleneck of the process.It uses the way of three-dimensional chip stacking to improve the system integration,and the TSV is used to achieve vertical interconnection between layers to improve the performance of the circuit.However,there is no uniform standard in the design flow of 3D integrated circuits,and there is no forming benchmark circuit which can be used to provide the function of 3D-IC for placement and routing.Therefore,the study of 3D integrated circuit benchmark has become the key to promote the technical progress of 3D IC design.In this paper,the placement and routing benchmark of 3D integrated circuit are studied.In this paper,a method of transforming 2D integrated circuit into 3D integrated circuit is presented,and this method is used to generate a set of standard 3D benchmark circuits.In addition,the layered algorithm of 2D-3D and the algorithm of TSV generation of cross-layer netlist are proposed.For the 2D-3D process,the planar interconnect netlist is transformed to TSV,so that the generated 3D benchmark circuit meets the standard of practical 3D circuit.In this paper,the algorithm of transforming the practical 2D IC design to 3D benchmark circuit is realized.Any 2D physical design can be transformed to 3D benchmark.Because the netlist of practical circuit design is not suitable for 2D-3D transformation,therefore,it's proposed that the integrated circuit is transformed to 2D bookshelf circuit,then,the 2D bookshelf is transformed to a 3D bookshelf circuit,so that the practical 2D IC design is transformed to 3D benchmark,realizing the customized 3D benchmark.In this paper,the design of the 3D benchmark inverse transformation to the practical 3D IC design is realized.In this paper,the corresponding transformation system platform is developed,which can make inverse transformation of the 3D benchmark generated by the 2D IC design to the practical 3D IC design,the 3D circuit is compatible with the 2D placement and routing tool,and can be used for the placement and routing of the 3D single layer circuit.In this paper,six different types of IC design are used to verify.By obtaining the TSV numbers,running time and other data,and the data are verified and analyzed.The results show that the proposed method can be successfully transformed to the corresponding 3D benchmark circuit for different types of circuit design and make inverse transformation to the practical 3D design.The research in this paper can not only provide a set of 3D benchmark for testing use,but also can transform the 2D practical circuit design into 3D benchmark,and make inverse transformation to the practical 3D design.This kind of 3D IC design can use 2D IC physical design tools to achieve the placement and routing work.Therefore,the overall research of this paper is of great significance to the development of 3D IC.