Font Size: a A A

Development Of Embedded And Electronic Integrated Dual Nozzle Composite 3D Printer

Posted on:2019-06-24Degree:MasterType:Thesis
Country:ChinaCandidate:Z H LiuFull Text:PDF
GTID:2348330542463836Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
The Additive Manufacturing(AM)technology is an important symbol of "The Third Industrial Revolution",to subvert the traditional manufacturing concept.The Additive Manufacturing can create any shape of the structure.Integrated manufacturing of embedded packaging electronic products is a new process of manufacturing electronic products that accompanied by the development of AM.This process has a wide range of applications.The appearance of embedded packaging electronic products has changed the single manufacturing process mode of traditional electronic products,and is an important product of the development of AM technology in multi material and multi scale direction.Embedded packaged electronic products are widely used in unmanned aerial vehicles,software robots,Internet of things products,flexible electronics,wearable devices and other fields.But the integration of embedded electronic products manufacturing package is still in its infancy,simple manufacturing process,high manufacturing cost of existing types of ink-jet printing technology can not meet the existing variable height,high precision,low printing the conductive ink,unable to meet the embedded electronic products with high precision,low cost,functional requirements.In view of the above problems,this paper designs and develops a dual-nozzle composite 3D printer for integrated manufacturing of embedded electronic products,and proposes an electric field-driven jet conductive ink method for printing the connection circuit of embedded electronic products and selects the silver glue of conductive material.It provides a new way of thinking and technology for high-resolution,high-efficiency,short-cycle and low-cost manufacturing of embedded electronic products,and provides a new way to realize the integrated manufacturing of materials,structures,electronic components and multilayer circuits.Specific research is as follows:1.The design and development of a manufacturing for embedded packaging electronic products,dual-nozzle composite 3D printer,creating an integrated composite 3D printing embedded electronic products,the principle and process,and dual-nozzle composite 3D printing Equipment,equipment,movement,control system,printing materials,etc.were given a detailed analysis,given the design and selection program.2.This paper analyzes the printing methods and disadvantages of high viscosity conductive materials at present,and proposes a printing method suitable for circuit connection of embedded packaging electronic products.Electric field driven jet 3D printing.The effect of micro channel structure on fluid flow analysis theory,through the numerical simulation to verify the effect of micro channel structure on fluid flow.The simulation results show that the nozzle pipe design shrinkage at the same entrance pressure,the inner diameter of the outlet under the same flow rate,faster than the straight needle.The experiments also validate this conclusion,and the driving jet printing high viscosity conductive material to provide theoretical guidance for the implementation of the electric field.3.In the process of wire printing,the distance between the nozzle and the receiving layer,the moving speed of the print platform,the voltage and the air pressure will affect the connection circuit.Using a single variable method,the nozzle spacing,to receive the print platform speed,voltage and pressure values of the four factors of injection circuit are connected into line with a precision influence line morphology on the electric field driven,determine the scope of the best printing parameters.4.The circuit has an important influence on the conductivity of the embedded electronic products packaging performance and energy consumption in electronic components,temperature tolerance range,the effects of different curing temperature on the conductivity of silver conductive adhesive,determine the best curing temperature range.5.With double layer embedded circuit light controlled night vision lamp as an example,the integrated manufacture of light controlled night vision lamp has been completed on the self built double nozzle composite 3D printer.The structure part is printed by FDM,and the circuit is printed by Electric field driven jet.The manufacturing capability of dual nozzle composite 3D printer in multilayer embedded electronic products was verified,and the embedded packaging electronic products were fabricated with short cycle,low cost,individuation and high efficiency.
Keywords/Search Tags:Embedded package electronics, Integrated manufacturing, Double nozzle 3D printer, Composite 3D printing, Electric field driven jet, Fused deposition
PDF Full Text Request
Related items