Research On Key Technologies Of Integrated Printing For Embedded Electronic Products

Additive manufacturing of functional electronics has unique advantages which offer an optimized and diversified range of applications particularly in the fields of nondestructive structural safety testing,wearable electronics,aerospace,medical and health care etc.Despite being at the initial stage of research,it has already received broad attention at home and abroad.In this paper,the study is being carried out on the effective combination of Fused Deposition Modeling and the conductive ink dispensing to manufacture functional electronics.The main research work is as follows:(1)Embedded electronics printing features were comprehensively analyzed,based on full investigation of its structure and circuit forming method,its printing solution was designed.Functional electronics printing process based on fused deposition and ink dispensing was established.(2)The dimensional accuracy of the printed product was explored.The results show that the actual size along the Z-axis is larger than the theoretical size regardless of the structural density.When the print part is solid,the actual size along the X-axis or Y-axis is larger than the theoretical size.When the print part is chamber,the actual size of the X-axis or Y-axis is smaller than the theoretical size.A high quality embedded model has obtained by designing the contour compensation amount based on the dimensional error.(3)The effect of pause time on the surface of the printed part was explored.As the pause time increases from 10 s to 270 s,the surface defect length increases step by step,the initial defect length is 40 mm and when the defect length reaches 80 mm then it tends to be stable.The pause transition model was proposed and the experimental verification was carried out to obtain the printed product with good surface quality.(4)Conductive traces for embedded electronic components were studied.The results show that the quality of the silver conductive ink is reduced by 25% and the volume is reduced by more than 32% after curing at 50°C for 6h.The resistance decreases first and then increases with increasing temperature.The optimum curing temperature range of silver conductive ink is 80°C to 140°C.A vertical circuit printing method was proposed,and the internal morphology of the vertical circuit was detected and analyzed.(5)The functional electronics printing example verification was carried out with the molten pool detection device as the case.Based on the fused deposition,the substrate structure printing was carried out,the ink dispensing system was used to print the conductive traces,the dimensional accuracy analysis and the pause transition model results were used to optimize the design process in order to avoid the surface defects caused by the long pause.Finally,the feasibility of printing solution for functional electronics was validated.