Key Technology And Experiments Of Embedded Electronic Products Integrated Manufacturing Based On Composite 3D Printing

In recent years,3D printing technology is developing rapidly,which with other digital production mode to promote the realization of the third industrial revolution.3D printing technology could create any three-dimensional model quickly and accurately through three-dimensional design data and widely used in aerospace,tissue engineering,automobile,construction and many other fields.In the electronics industry,3D printing technology also has a rapid development.“Embedded electronic product”,a new type electronic product has appeared in recent years,its manufacturing method is a typical multi-material and multi-scale manufacturing.However,3D printing technology in the integrated manufacturing of embedded electronic products still exist inadequate and challenging problems,At present,the problem of the fewer types and higher price of 3D printer which could achieve embedded electronic products hinders the further application of the technology.To solve the above problems,a new method of composite3 D printing which based on fused deposition and EHD printing was proposed.On the embedded electronic products manufacture,the functional structure was made of fused deposition,the circuit wire part was made by EHD printing technology used conductive ink jet as printing material.Concrete from the following several points were studied:1.A new process of composite 3D printing integrated manufacturing was proposed,the basic principle and process flow of composite printing embedded electronic products manufacturing process based on FDM and E-jet was stabled.According to the requirement of embedded electronic structure integrated manufacturing,the functional structure of embedded electronic structure and the key technology of manufacturing wire are confirmed.On the basis of the mechanism of FDM,E-jet printing,refined and optimized printing process.2.According to the characteristics of embedded electronic product structure,the structure design principles and methods of embedded electronic products was put forward.And the circuit path was optimized by the method of "routing obstacles routing" and "ant colony algorithm" with the structure design principle.3.Voltage is the most important factor influencing the line performance of EHD printing,in the connection circuit manufacturing process of embedded electronic products,the continuity and stability of connection line is an important premise to realize the connection of the internal circuit in embedded electronic products,and thereby realized the functions of electronic products.In this paper,through the numerical simulation of COMSOL Multiphysics and the experimental study of independent research and development of E-jet printing experimental platform,carried out the theoretical analysis and experimental verification on the effect of printing mechanism of printing conductive silver paste in different voltage,revealed the mechanism of the effect of voltage on formation of Taylor cone and verified the stability and feasibility of conductive silver paste with E-jet printing.4.Under the premise of guaranteeing the internal circuit of the embedded electronic products connects,the high resolution of the connection line was realized,and the beautiful manufacture is one aspect to consider in the manufacture of embedded electronic products.In this paper,through the experimental study of E-jet printing wire,analyzed the effect law of different printing parameters(conductive silver paste volume concentration,spraying voltage,spraying distance and the speed of jet head)on the conductive properties performance and line performance,and through the optimization experiment,optimal conditions of the fixed printing parameters were obtained.5.Taking the two-dimensional(single)and three-dimensional(layers)circuit of the smart bottle cap as a case,carried out the integrated manufacturing based on the composite 3D printing embedded electronic products.The functional structure of smart bottle cap was manufacturing by fused deposition molding technology,connection of electronic components was made by E-jet technology printing conductive silver paste,using the pause/printing continued of fused deposition modeling printer to embed the electronic components.Realized the rationalization,compact,high efficiency and low cost of the integrate manufacturing on embedded electronic products.