The Design And Analysis Of Multi-layer PCB Layer-stack Structure

Printed circuit boards(PCB)are requiring more and more components,and The signal frequency is getting higher and higher with The speed of electronic products becomes faster and faster,so designers choose Multi-layer PCB to deal with These problems.At The same time,it will bring many problems,such as Electromagnetic Compatibility(EMC)of PCB,Signal Integrity(SI),Power Integrity(PI),Layout and Routing,The design of Layer-stack structure and so on.And as The multi-layer PCB layer-stack structure will directly affect The Electromagnetic Compatiibility,Layout and Routing of PCB,at The same time,it also has important impact to The Signal Integrity and Power Integrity,that means The design of multi-layer PCB layer-stack structure is an important step for multi-layer PCB design.Therefore,The following aspects were studied for multi-layer PCB based on The Theory of The S-parameter and Far/Near field radiation:1.All The layer-stack structures of different layers of PCBs are screened through The basic principle of multi-layer PCB layer-stack structure design,which provides layer-stack structure scheme for subsequent simulation.2.Multi-layer PCB S-parameter has been analyzed to explore The wheTher The return loss of The different layer-stack structure is same or not,at The same time to provide The Theoretical basis for determining The resonant frequency of The PCB.3.Multi-layer PCB Far/Near field radiation has been analyzed to explore The wheTher The radiation intensity of The different layer-stack structure is same or not,which lays The foundation for selecting The appropriate layer-stack structure program.