Design And Research Of Visual Positioning Technology Based On Chip Wire Bonding

With the development of integrated circuits,advanced packaging technology continues to evolve and adapt to the needs and challenges of various new semiconductor technologies and new materials.The connection between the internal chip and the external pin and the chip of the semiconductor package plays an important role in establishing the electrical connection of the chip to the outside in order to ensure a smooth input / output between the chip and the external world and is the entire thickness After the packaging process is very important steps,more than 90% of all package pins using wire bonding welding,to achieve a simple,low cost,suitable for a variety of dominant position of the connection.Before the wire bonding,a semiconductor element of high purity Si or Ge,which is cut off from the lead frame material(outer lead)by cutting the metal strip,is pressed by a hot pressing method on the lead frame,and a conductive resin such as a silver paste is coated top of metals frame;and then bonding the semiconductor element(circuit)and the wire to the lead frame by means of a special welding tool,the bonded circuit being Protective resin encapsulation.the machinery vision system research and integrated circuit chip manufacturing equipment,integrated circuit chip visual inspection emerged as mushroomed.From the printed circuit board(printed circuit board)test,wafer packaging process and to the solder joints,wire quality testing,to real-time detection and control,more and more widely used areas.The vision system is used for simple inspection and classification of the existence of inspection,involving dimensional inspection and surface quality inspection,and then on the integrated circuit chip precision positioning,which will greatly improve the visual servo control and visual system real-time And complexity.As the chip integration is becoming increasingly high,chip packaging equipment in the visual system,has become the impact of chip packaging speed and accuracy of one of the indispensable factors.The world's leading packaging equipment companies such as K & S,ASM,ESEC,and so has developed a variety of uses of the bonding products to meet a variety of packaging and bonding requirements in the chip packaging equipment sales market share is very high;In recent years there have been successively less than 2.5um welding accuracy,wire speed greater than 12 lines / second high-speed and high precision automatic wire ball welding machine,such as K & S's Max?m ultra,ASM ENGLE-60,ESEC WB3100,Improvements in the accuracy and speed of all of these control systems are primary in virtue of the use of linearity motor drives,soft touch control and many other new technologies for the adoption of 3D workstations;and the use of multi-magnification microscopes for vision systems System,a high-definition CCD camera and a unique visual positioning method.The main intent of this paper is to examine the operation of the robot precision platform in the 3D space,such as chip wire bonding,so the main research will focus on the design of the visual controller and self-calibration of the camera parameters in the microscopic environment,Positioning method and the effect of visual control,and discusses the coordinate transformation relationship between vision systematic and motor dominate system conformity,and the retroaction control realization mode.In the existing experimental conditions,the actual production environment simulation experiments show that the adjustion algorithm of micro-vision system based on chip package raise in this discourse is more precise and little error,which can meet the industrial application.