Module Product Function Failure Analysis And Design Improvement

SMT(Surface Mount Technology)the initials,the Chinese meaning represents the surface mount technology.It is a widely used new generation of electronic assembly technology,it will compress the traditional electronic components only a few tenths of the volume of the device,and then paste it to the circuit board.In this document,Ericsson RU module products for failure analysis,the use of DOE methods and methods to solve the SMT production in the key challenges encountered.At present the work is more and more foreign exchanges,and the Nordic Ericsson customers in the cooperation,for PTH(through hole plug)welding problems,usually to improve the reflow soldering furnace temperature and improved printing steel mesh and printing parameters.There is no systematic solution to the problem of PTH device function failure.In this paper,a solder joint model is established for Pb63-Sn37 soldering of BGA solder paste and a lot of software,including ANSYS software,is used to model the composite solder joint formed by Pb63-Sn37 solder.Meanwhile Chip,and pad material,and the influence of these factors on the welding effect and the stress of the solder joint are also discussed.The optimum pad size,the size of the solder joint and the material of the pad are obtained by optimizing the design method.Use the program.After the optimization of the design parameters,the use of laboratory cross section(slice analysis)approach,the failure of the project to slice analysis,the use of high-power electron microscope for data measurement,verify the improved reliability.Finally,the improvement will be applied to the actual production,and put into use in mass production and track production.Has been a lot of cost savings,about 15,000 US dollars per month.Access to a great success,the company has been very well received.