Spread Spectrum Communication Research, The Miniaturization Of The Microwave Front-end

Extensive use of T/R ( Transmit / Receive) modules in today systems for commercial and military communications are demanding low weight, smaller dimensions and high reliability . The availability solutions of compact T/R modules have been possible through several technologies , improved packaging techniques with the use of Microwave Multi-chip Modules implemented in multi-layers ,Multi-layers configurations make Microwave circuits more compact .In this paper ,a compact configuration of a three-line balun in two-layer geometry has been analyzed and fabricated ,it exhibit wide band-widths and good balance characters due to tight coupling in coupled-line.The microwave communications with spread spectrum technology are widely used in the military and civilian fields by virtue of lower density of power spectrum , it has many advantages , such as its anti-interference capability , its good security , its robustness to multi- path fading .we set down a novel scheme for use of T/R front-end of spread spectrum systems. The MAX2721 / MAX2701 chipset takes full advantage of a direct conversion (or zero-IF) radio architecture , eliminating one to two IF down-conversions found in typical super-heterodyne systems today .The Result reduced component cost along with improved reliability .In this paper ,Techniques for miniaturizing microstrip patch antennas have been investigated, high dielectric materials antennas and optimized H-shaped smaller antenna have been analyzed and fabricated for use with all 2.45GHz applications where small size and low weight are key factors.