Research On Temperature Field Of Lithography Dual Drive Wafer Stage

Wafer stage system is the core of the lithography system，especially themicropositioner is very important for the performance of the whole system. In theworking process of lithography，line width and set of carving precision as veryimportant performance parameters，are mainly affected by the performance ofmicropositioner，and the change of temperature of micropositioner is one of theimportant factors that affect its performance. The speed of ultra high density ICdevelopment is faster and faster，with temperature as its influence factor，thetemperature plays a more and more important role，so the temperature precision andstability of the control put forward higher request. So this paper carries out thesubject of research on temperature field of lithography dual drive wafer stage，inorder to achieve nanoscale localization accuracy with the synchronous motionaccuracy and develop high speed and high precision step-scan lithography，whichcan resolve the difficult problem of ultra precision positioning control and highspeed and high precision synchronous scanning technology of90nm step-scanlithography.This paper summaries the research status of wafer stage at home and abroad，and introduces the knowledge of heat transfer and finite element method. ThroughANSYS finite element software，this paper can carry out temperature field analysisand structural analysis for Epin. Through temperature field analysis，this paper canget temperature distribution and thermal deformation distribution of Epin. Throughthe static analysis，this paper can get the deformation and stress distribution of Epinunder its own gravity，and make sure it has certain stiffness in order to improvepositioning accuracy. Through the modal analysis，this paper can get the dynamiccharacteristics，and find out the weak links and provide guidance for the structureimprovement.Through SolidWorks2011and ANSYS software，this paper can establish theentity model and finite element model of the mocropositioner. The heat source isanalyzed and calculated，this paper can get the heat generated by XY planar motorand Z gravity compensator，which is applied on the micropositioner. Through thethermal analysis and thermal stress analysis of the micropositioner，this paper canget temperature distribution and thermal deformation under different thermalloading，and analyse the deformation generated by the gravity and temperature.This paper selects PT100temperature sensor，in order to carry out the tempe- rature experiment of XY planar motor stator. The temperature of XY planar motorstator is analyzed without water-cooling device，this paper measures the tempetureon the surface of cooling plate，water inlet，water outlet，and the coil winding. Bycomparing the experimental datas and simulation results，the coil winding under theeffect of water cooling device is cooling.