Font Size: a A A

Research On Drop Impact Response Of Pwith Vulnerable Parts

Posted on:2017-07-11Degree:MasterType:Thesis
Country:ChinaCandidate:F H XuFull Text:PDF
GTID:2348330509952777Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
In the transport, handling and use process, drop impact is the result of one of the main reasons for the failure of electronic products, and printed circuit board are almost all electronic products essential components and electronic equipment failure often with the circuit board. When the printed circuit board is subjected to the shock, the deformation and acceleration response can be produced, and the deformation or the acceleration response of the printed circuit board is led to the circuit board component solder joint fracture or the destruction of the components, heavy damage will cause the circuit board itself.It can be seen that the circuit board is the key part of the electronic equipment,the performance of the circuit board itself directly determines the overall reliability of the electronic products. This paper focuses on the response of the printed circuit board in the drop impact, the main research work is as follows:It was established the basic dynamic equation and the general solution of the plate vibration by the basic principles of dynamics. The impact collision experiments were conducted a on the side of the fixed circuit board under the versed sine wave pulse response, to verify the theory. Through the study found:the circuit board drop of maximum stress and maximum stress required time and versine pulse cycle is proportional to, and material coefficient ? is inversely proportional to. With the increase of the length of the circuit board, the maximum stress of the circuit board becomes longer, and the maximum stress of the circuit board becomes larger at the same time. With the increase of the thickness of the circuit board, the time required for the maximum stress is shorter and shorter, the maximum stress of the circuit board is also significantly reduced. It is also found that the deformation and the response of the circuit board which is fixed on four sides are smaller than that of a pair of edges, and the response of the rectangular wave pulse excitation is larger than that of the same energyTo study the protective effect of foamed polyethylene on the circuit board.In the drop impact test bench, in the four corner points supported fixed circuit board system below the liner polyethylene foam, found that: polyethylene foam on the circuit board buffering effect is obvious. The same drop height and different thickness of the polyethylene foam cushioning effect on the circuit board without much difference; and the same thickness of polyethylene foam of different drop height of the buffer effect is significantly different.
Keywords/Search Tags:Vulnerable parts, Printed circuit board, Drop impact, Dynamics modeling, Buffer theory
PDF Full Text Request
Related items