Structural Design And Error Test Analysis Of Wafer Test Motion Stage

The core of today's IC manufacturing industry belongs to IC technology, is the most concerned part of the design firm, it is also the largest investment part. As the basis for semiconductor manufacturing, wafer testing and manufacturing technology is the most important part. Based on the background of wafer manufacturing technology, sophisticated detection equipment for wafer inspection process design and research.Firstly, the design requirements and technical parameters of the subject wafer inspection platform, compared to the advantages and disadvantages of three degrees of freedom and four degrees of freedom, choice and design suitable platform for this project overall program. And in accordance with the subject proposed accuracy requirements for the use of three-axis motion drive system platform for analysis and selection.Analysis, selection and verification research of critical component including cylinder, voice coil motors, encoders and rolling guide are accomplished. The precision positioning control experiments are conducted. The results show that its vertical positioning accuracy is of ±0.1?m.This paper measured motion error of prototype of silicon testing platform in Z direction. Furthermore, caused factors for motion error in Z direction were analyzed. Indeed, structure o f load platform and driving mode of silicon testing platform prototype were improved and mul ti degree of freedom coupling errors analysis were put forward.