Design And Optimization Of SMD Vacuum Pick-up Head

China has become the world's largest and the most important SMT(Surface Mount Technology) market Since twenty-first Century. SMT products and equipment is a key link in the semiconductor packaging industry and can pickup?transfer and placement SMD(Surface Mounted Devices) components efficiently?stably and accurately. The role of the pickup head is to pick and place the SMD components. SMD components have many types and dimensions, so the process needs to have a pickup head which have good adaptability. This paper mainly designed and optimized the SMD pickup head and developed the adaptive pickup head for SMD detection equipment. Through the research on the structure design, simulation and test work, this paper made the following research results:1) The design of the nozzle assembly is innovation, being adapt to a variety sizes of SMD components. It avoids the replacement of suction nozzle frequently caused by the change of SMD type and improves the production efficiency.2) Simulated the effect of the suction nozzle parameters on the flow field around the pickup head. The simulation results based on Fluent software show that: Add a chamfer in the position of sudden change of the diameter has not a significant effect on the flow field of the suction nozzle mouth. When the number of vent hole is more large, the pressure distribution of the suction nozzle mouth is more uniform, the vacuum degree of the suction nozzle mouth is more higher and SMD components is more conducive to be picked up. When the diameter of the vent hole is bigger, the pressure distribution of the suction nozzle mouth is more uneven, but the vacuum degree of the suction nozzle mouth is higher. The pressure distribution of the suction nozzle mouth is more uniform, while the groove is deeper.3) Experiment tested and verified the design scheme and simulation results. we get the following conclusion by the experiment performed on the SMD testing equipment installed the new pickup head: Verified the rationality of the design of pickup head by pickup head multi adaptability experiment. Got the table of the relationship between inlet pressure and the vacuum degree of the pickup head of the equipment and provided data support for later detection of equipment leaks. Analysed the reasons of different errors and provided corresponding technical support for the search of the causes of failure after.In short, the adaptive pickup head structure and the analysis conclusion can meet a wide range need of the SMD transfer process and has been verified in practical testing equipment.