Design And Implementation Of Miniaturized DC/DC Converter Based On LTCC Process

In recent years,the domestic military,civilian areas,in communication,network,storage and ATCA,PCI Express card and battery powered devices using the foreign point of load power supply,and mainly by PCB and plastic packaging materials,in high reliability applications,there are many shortcomings,there are also risks related to break the embargo,limit according to the product quality grade,the main content of this thesis is to study the domestic production of LTM4616 of foreign Linear Technology,and to improve the product quality level,so as to solve the domestic demand of a key model of our country.Based on the technology of miniaturization of the DC/DC converter requirements analysis research,circuit design,testing,with the integration of component technology developed in recent years,Low Temperature co-firing Ceramic(Low Temperature Co-fired Ceramic,LTCC)technology as a means of technology,combined with the general process of thick film hybrid integrated circuit,the design and implement a high efficiency,high power density,miniaturization of DC/DC converter.The primary works in this thesis are presented as follows:(1)Determine the technical scheme adopted by the product,including circuit scheme,process scheme,layout scheme,test scheme,application verification scheme,etc;(2)Based on the characteristics of LTCC process,the design of miniaturized layout is realized by using multi-layer ceramic structure,and the layout,packaging and welding methods of the products are determined;(3)Based on the characteristics of thick film hybrid integrated circuit technology,the product process flow,screening methods and quality consistency requirements are determined;(4)Combined with the characteristics of high power density,the product test scheme are designed and implemented,and the special test fixture and circuit board are made.The domestic product researched in this thesis is a non isolated synchronous rectification buck type DC/DC converter using LTCC process chip,thick film hybrid integrated process and non isolated synchronous rectifier.As a point of load power supply,this converter has been widely used in many types of machine models in many domestic research institutes.Through this study,we will understand the general process of LTCC process,thick film hybrid integrated circuit technology and the key technologies and difficulties involved,understand the testing methods and screening methods of LGA and BGA-based packaging products,and understand the reliability of the products.It has extensive reference value for the design and development of similar products.