Test Analysis Of Security Performance Of Organosilicon Materials Encapsulating Junction Boxes

With the development of modern society,the electrical equipment in people's life plays a more and more important role,especially in the construction of modern buildings,for electrical equipment and electrical lines put forward higher request,the increase of using electrical equipment and electrical wiring operation base increased the risk of electrical fires.Electrical junction box in the wire and more complex,hidden parts of the electrical wiring is important,in the electric circuit construction and installation in the junction box installed to take cover engineering or in the narrow space,not easy to be perceived,in the event of short-circuit,overload,lead to poor contact etc,consequence is very serious,even pose a threat to people life.In this paper,organic silicon encapsulating junction box,technology,outside the wire in electrical wiring terminal box full of potting material,using physical,chemical properties of the silicone protection electric circuit,electrical wiring to improve the safety of the whole.First studied the encapsulating junction box,related technologies,including the definition and role of potting,potting material selection,potting process,such as identified by the organic silicon material as potting material,according to the requirements of the electrical wiring potting the organic silicon materials preparation and potting experiments,made a simulation device for electrical wiring junction box.Then the heat and heat conduction principle of the electric circuit conductor was studied,and the relationship between the temperature of the conductor and the surface temperature of the conductor was obtained.Then studied the infrared thermal imaging technology,mainly for temperature measurement principle and error analysis of the thermal imager test,infrared imager was used to study the organic silicon encapsulating junction box,thermal conductivity,the simulator potting before and after potting junction box temperature test under different working conditions,and analysis of data and images.The higher the load on the electrical circuit,the higher the temperature of the wire joint in the junction box,the greater the temperature difference in the downpour,the better the effect of the sealing effect.The heat in the junction box is concentrated in the junction of the conductor,and the heat is spread out in the junction box.The reliability tests have been carried out to the organic silicon material and electrochemical analysis,analog electric circuit using environment,evaluation of the reliability of organic silicon encapsulating junction box.Through the full visual inspection before and after the test,electron microscopic analysis and local ac impedance test and analysis,it is concluded that organic silicon material in the ultraviolet irradiation,salt fog,humid heat test has a good protective effect,comprehensive analysis and evaluation of organic silicon encapsulating junction box,security,is of great significance to preventing fire electric circuitry.