Analysis And Application Of High-Speed Signal

With the higher clock frequency, the jump time of signal will be shorter. As a result, the interconnect design of high-speed digital PCB will have a far greater impact on the whole system’s electrical performance. In the high-speed systems, there will be a series of SI(signal integrity) and PI(power integrity) problems when the high-speed signal pass through the interconnect lines. Consequently, how to deal with the SI and PI problems caused by high speed interconnect has become one of the key issues in the design of high-speed digital system.Signal integrity issues mean the signal’s quality on the signal line, which is caused by a variety of factors in the board-grade design. The traditional design method which depends on the personal experience is unable to meet the high performance and high density PCB design, and a good design needs throughout all the stages of design. The analysis of high-speed PCB board-grade signal integrity can solute the potential SI problems during the design stages and guide the design of high-speed systems.Based on the SI principle, the SI problems such as crosstalk, reflection and simultaneous switching noise are analyzed, and the relative solutions are discussed in the thesis. Then, the system is analyzed and designed according to the high-speed PCB signal integrity design process. Under the Cdaneec’s ALLEGRO software environment, the DDR3 parallel high-speed bus is simulated and analyzed, such as the routing topology and crosstalk analysis. The relevant layout and routing rules based on the simulation results can be used to restrain the design of PCB, which proves the importance of the simulation analysis and design method of high-speed PCB design.