Reliability Test And Failure Analysis For Smartphone Baseband Chips

Reliability is an important quality measurement of the smartphone baseband chip products; meanwhile, reliability is the premise for the competitiveness of a product when it is ready to be put into the market. As an important method related in quality control of integrated circuits products, reliability test, this new branch of science gets more and more attentions from the enterprises and customers. As the integrated circuits industry rapidly developing, led to a significant development in the smartphone chip market, more challenges has shown up at the same time. The feature size of the smartphone baseband chip products keep decreasing led to a higher demand of the reliability, the product quality can not only rely on simply eliminating the defective ones by regular tests, which can not meet the overall quality control and product improvement, therefore, failure analysis rises in response to the proper time and conditions. A significant failure always coming up with a low yield of the whole production line, which brings loss for the enterprise, failure analysis is the best practicable means which can fundamentally find out the key sticking point of the problem, and at the same time prevent the similar failures continuously coming up. Combined with the reliability tests and failure analysis results, vulnerable spots of the products can be positioning, so as to enhance the industrial yield.In this paper, using several lots of domestic mainstream smartphone baseband chip products as test samples, analyze the back-end quality of the products from the reliability tests process design, test conditions, test result analysis, failure analysis and etc. by synthesis. Based on the life cycle character of smartphone baseband chip products, build up mathematical models for reliability description, propose early life failure rate calculating methods and optimization; based on reliability test standards, lay down sample acquisitions, design test items and methods, extract failure samples from tests; for the chips failed in the reliability tests and the corresponding batch of products, proceed data failure analysis, electrical failure analysis and physical failure analysis, positioning the failure locations and failure mechanisms and concludes a feasible proposal which can help with the yield improvement.