| Magnetron sputtering system is widely utilized in copper interconnection with integrated circuit devices. With the development of linewidth in VLSI from 65 nm to 32 nm and 28 nm, structures with high aspect ratio on substrates are more and more used, resulting in reduction in the ability in filling groove, uniformity and the deposition rate. Aiming at the issue to improve collimation in sputtering systems, this paper finished the following research with the endorsement of National Science and Technology Major Project(2011ZX02403):1) The calculation model of single electrified coil has been established to analyze the distribution on the coil plane and the vertical plane. Based on the results, the circle coil model and the arc coil model have been proposed to analyze the influence of different electrified modes on the axial distribution of the axial magnetic field.2) The aumomatic operation flowchart has been proposed for IC devices calculation platform, which is constructed on the basis of commercial simulation softwares. Aiming at typical IC devices, commercial simulation software has been redeveloped, user interfaces have been built and self-compiling programs have been built to analyze automatically. The effectiveness of the platform has been verified by the example of PECVD, and the reliability of the platform has been verified by the high power impulse magnetron sputtering system example.3) With utilizing the simulation platform, this paper has proposed a design scheme of auxiliary pole for C shape magnetron sputtering system. The static and dynamic match schemes have been established and verified by the commercial finite element analysis software MAXWELL, then the position error has been explained according to the dynamic property.4) The work flow and method of auxiliary magnetic pole design for magnetron sputtering systems with rotating magnetrons have been concluded. Typical examples were taken to illustrate the match process in either static mode and dynamic mode. |
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