Research And Development Of CAPP System For The Assembly Of Electronic Products

Electronic products assembly process planning is the key section in the production ofelectronic products. Shorten the printed circuit board assembly process planning time andimproving the quality of process planning is the key to improve the quality of theelectronic products and the benefit of the production enterprise. Setting the electronicproducts assembly process as the foundation and combining the basic principles of CAPPsystem development, this paper make a depth study of the electronic products assemblyCAPP system, at the same time a detailed explanation of the development process of theprototype system was made. The research work of this paper and the main contentsinclude:（1）The research base of electronic products assembly CAPP system and keytechnologies. Analysis of assembly process and characteristics of electronic products,combined with the CAPP system basic theory and construction method, proposes theassembly of electronic products the basic concepts of CAPP system. And the systemarchitecture and the basic function module and realization method, key technology anddevelopment environment tools to do in-depth analysis. Putting forward the basic conceptof electronic product assembly analysis, application the polychromatic sets theory to buildthe composability analysis model, combined with polychromatic sets of logical reasoningto achieve composability analysis, finally according to the enterprise actual productionsituation generate analysis report of assembly.（2）Study on process planning and assembly of electronic products. Printed circuitboard assembly concluded assembly of electronic products in the process of constructingthe system development process, the typical process knowledge base, combined with thedevelopment of technology of modified CAPP system and basic principle, in line with thedevelopment of CAPP system of electronic products assembly; with composite SMTplacement process optimization for example, paste to pack first optimization model is setup, then genetic algorithm and cellular genetic algorithm to solve the model, finally get theplacement process optimization results, the results on the application of man hour quotasystem for subsequent analysis.（3）Simulation Research on the process of post installed model library based on. Twosecondary development technology based on Pro/E, the application of3D parametricmodeling function, the establishment of three-dimensional parameters of common electronic packaging component model library,3D dynamic simulation of typicalmounting equipment of3D simulation technology of reuse, assembly defects may appearin the process by simulation techniques to detect electronic products.（4）Electronic products assembly CAPP system development research. Combinedwith the characteristics of electronic products assembly process and electronic productmanufacturing enterprises, using polychromatic sets constraint model is established forPCB assembly flexible job shop scheduling model of multi object optimization,multi-objective optimization algorithm to solve the model of improved NSGA-II modelbased on the scheduling constraints, Gantt chart, and the optimization module integratedinto electronic products assembly CAPP system, further improve the system function.（5）Design and Realization of CAPP system for electronic product assembly. Forelectronic products assembly CAPP system function modules and planning analysis, subfunction modules are realized, the assembly of the CAPP prototype system of electronicproduct development, and the system functions are described, and gives the example of thesystem.