| Wafer Level Camera (WLC) is manufactured based on Through Silicon Via (TSV) image sensor chip and Wafer Level Optics (WLO). Compared with the traditional camera module, the most prominent feature of WLC is much more lightweight and thinner. Traditional camera is composed of10-20components with height of5.2-6.0cm. It becomes the bottleneck of the miniaturization of mobile phones. As comparison, WLC is composed of three components with height of2.7-3.3cm. In the case of high standard and quantified manufacture, the automated semiconductor manufacturing process can embody the low cost advantage. The fast development of smart phones brings new requirements WLC.Based on TSV technology image sensor, WLO and packaging shell, the wafer level camera (WLC) can be produced. In this thesis, the author mainly researches the WLC packaging process including adhesive dispensing and cleaning process with selecting different TSV chips and WLO components for packaging process. Focusing on the influence of resin bond to the device, the author evaluates different properties of glue bonding materials and the different cleaning methods on the quality of the packaging device. After the completion of packaging process of WLC, for the reliability of the device test and analysis, which mainly includes high temperature storage test, impulse test, constant humidity and temperature treatment and so on. The effect factors of reliability are analyzed, the author furthers the failure mechanism of the thermal stress simulation.Through the author’s research work, optimization of WLC process is included adhesive dispensing, cleaning process. And using a simulation model of thermal stress in combination with the reliability test results on the device, we can select the most suitable materials and packaging technology process for wafer level camera manufacture. Eventually the research results will be applied to quantified WLC process in production that can satisfy the requirements of production yield. |
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