High Performance Of Package Material Of Electronic Components With Epoxy Resin Matrix Based On Silsesquioxane

Owing to various factors such as ease of processing,low cost, goodmechanical properties,and environmental advantages, epoxy resins arecommonly used for applications including adhesives and insulatingmaterials fo electrical devices.Recently,many researches focused on theimprovement of the dielectric and thermal properties of the epoxymaterials because of the application on electronic packagingmaterials.Consequently,some alternatives containing phosphorus, silicon,and nitrogen moieties were used.In this article, three kinds of monofunctional isocyanate polyhedraloligomeric silsesquioxane(NCO-POSS) was synthesized via a series ofreaction starting from phenyltrimethoxysilane [C6H5Si(OCH3)3],and wasadded into epoxy resin to improve thermal and dielectric properties.The glass transition temperature (Tg) of heptaphenyl POSS and heptaisooctylPOSS displayed a tendency to increasing at first and decreasing in theend,but the heptaisobutyl POSS displayed a regularly decrease bydifferential scanning calorimetry (DSC),as well as water absorptionrate.Permittivity measured by Precision Impedance Analyzer(LCR) wasdecreased at first and increased in the end with the increased content ofNCO-POSS.TGA was applied to evaluate the thermal stability of thecomposite,but there is nearly no difference between neat and modifiedepoxy resin.Then,the third component the Tg of which is much higherthan that of the general one was added into the system,and a kind of resinglue was obtained which showed a higher performance on thermalproperties,permitivity,flexural modulus and water resisting property.Atlast,the performance of several kind of Copper Clad Laminate modifiedby seven types of POSS was studied,and the octavinyl POSS showed thebest effecton the combination properties.