Note Book Computer Thermal Module Fin And Strutural Parts Optimization Design

In recent years, with the rise of the notebook computer, light, thin, short and smallbecome the development trend of the main requirements, customer’s feeling is more andmore high. The three most important points are as follows. First, fast speed of calculation,program diversification.Second, good heat performance, human contact with the notebookcomputer without hot spot, and the weight should light. Third, high performance price ratio.On the first point, the chip manufacturers and software vendors will provide solutions. Onthe second point and the three point, as a thermal engineer, the problem to be solved is thatof good performance of the thermal module; make weight become light, suitable to carry;choose cheaper materials, in order to achieve high performance price ratio. This article isto improve the thermal module heat transfer capability and reduce the weight of thethermal module. Therefore, thermal analysis and structural optimized design of thermalmodule, for improving the thermal performance and great significance to reduce weight.In this paper, through FLOEFD and ABAQUS simulation software, simulation ofnotebook thermal module, also reflect the important role in the design of the simulationsoftware. The main work include:1.Thermal simulation analysis of using the FLOEFD software, choose suitable findensity, thickness, material, and carries on the experiment to verify the simulation results.2.Use the field synergy principle for structure optimization design of fin, includingpunch the convex closure, slotted, move slotted position, change the convex closure shape,and the convex closure of distribution, use FLOEFD simulate and do experiment to verifyof the sinulation results.3.Use ABAQUS software, analysis the stress of structural part, remove the materialwhich the stress is low, carry on experiment to verify the simulation results.4.In the optimized fin and structure condition, do thermal performance experimentagain, confirm the thermal performance after optimization is to improve.