| With the rapid development of IC industry, IC chips get smaller area and bumps gethigher density, proposing a higher velocity and positioning accuracy requirements on ICbonding equipment, bringing great challenges to high precision positioning platform and itsservo control method. Aiming at high-density flip-chip bonding equipment, this article carriesout theoretical research and practical application in terms of control system designing,mathematical modeling and control strategies to develop high-precision positioning systemfor IC packaging equipment. The main contents of this article are as follows:1. According to the objects and processes of flip-chip bonding, the technical indicatorsof flip-chip bonding equipment is made clear, therebefore proposing the performance index ofpositioning platform and completing control system design in detail.2. To analyze the characteristics of XY positioning platform, the mathematical modeland simulation model is built, and the parameters of the controller is adjusted by step signal insimulink.3. Due to the presence of perturbation, end effects and strong nonlinear disturbance inXY positioning platform, it is difficult for traditional PID control to meet the requirements ofhigh-precision positioning control, then the fuzzy adaptive controller is designed andsimulation analysis is completed.4. In order to carry out experiment research on control system and control methods, theXY positioning platform module of high-density flip-chip bonding equipment is taken as anexperimental platform to test the travel range, static characteristics and positioning accuracyof positioning platform. The results show that XY positioning platform meets therequirements.The research achievements in this thesis are successfully applied to the high-densityflip-chip bonding equipment. The control strategy that proposed can also be extended to thehigh-precision positioning of IC chip manufacturing and other places need precise positioning,which has broad application prospects. |
PDF Full Text Request