Control System Design And Implementation Of Decoupling Parallel Leveling Machine For High Density Packaging

Due to dramatic increase in the number of IC chip's unit area bumps, it comes with higher requirement for chips pick-up in bonding process, alignment accuracy and consistency in transfer process, especially in terms of high density bonding where precise alignment of chips and substrate parallel requires higher chip leveling feature. The object of this thesis is decoupling parallel leveling mechanism of patch unit in high density flip chip bonding, to study its control system design, kinematics modeling and control strategy based on a voice coil motor driver, in order to improve control accuracy of decoupling parallel leveling mechanism.The main contents of this research includes:1. Analyzed design requirements for control system of decoupling parallel leveling mechanism under actual high density bonding working conditions.2. Proposed a kinematic model for decoupling parallel leveling mechanism, and did simulation analysis based on Adams. Calculated in details of kinematic model for simplified decoupling parallel leveling mechanism, including mathematical relationship between the position, velocity and acceleration. The simulation result of Adams shows the effectiveness of the kinematic model for simplified decoupling parallel leveling mechanism, and could be used for analysis and design of control strategies.3. Proposed a compound controller based on the kinematic model for decoupling parallel leveling mechanism, to improve motion control performance of decoupling parallel leveling mechanism. The joint simulation of Adams and Matlab shows that comparing to the conventional PID controller, the compound controller not only reduced the system overshoot significantly, shortened the settling time, but also reduced the systems following error to a certain extent.4. The experiment of control system and control strategy further verified the effectiveness of the control system and compound controller. The compound controller, which is based on the position system requirement of decoupling parallel leveling mechanism, shows an outstanding performance consistent with the simulation and improved control effectiveness.5. The final leveling accuracy measurement shows the proposed compound controlling algorithms effectively improved the control precision of the decoupling parallel leveling mechanism, meeting the precision requirement.The research and results has been successfully used on high density flip chip bonding experiment platform with a good control performance. The decoupling parallel leveling mechanism control system could be extended to other fields of semiconductor packing where requires high alignment working conditions, and has good prospects.