Research Of Signal Integrity And Interconnection Design Base On MCM

Multi-Chip Module can effectively increase the packaging density of the wholesystem. This technique has been highly regarded and widely applied both in militaryand civil areas. With rapid development of the high-integrated and high-performanceMCM, signal integrity issues become more and more serious. So it is crucial that thestructure of high-speed interconnect is modeled and simulated accurately and efficiently.Based on the theory of transmission line and the signal integrity analysis method,this paper introduces the mechanism of reflection and crosstalk, and analyses the basictheory of the differential pairs in details. Firstly, various discontinuities of single-endedinterconnections in MCM, such as corner and via, have been analyzed and simulated onsignal integrity. And the solutions to optimize the single-ended interconnections areobtained by considering the simulation results. Secondly, the interconnect parameters todisturb the level of crosstalk voltage are compared by time domain simulation.According to the simulation results, this paper draws the best solution in order tooptimize the design object. Finally, after simulating the differential lines, corners andvias, some conclusions which can reduce the SI issues of differential interconnection aredrawn in the paper.This paper implement the physical design of the Network Protocol Interface MCMbase on the constraints which get from the analysis and simulation about the SI issues inMCM. Then, simulations of the high-speed differential interconnections includingRapidIO and PCI Express in the Network Protocol Interface MCM verify the validity ofthis designing scheme.