IDC Room Thermal Design Optimization Based On ANSYS Thermal Analysis

CPU’s self-heat will cause hot spots with negative effects on hosts’ heat dissipation.The work focuses on heat dissipation optimization for IDCs in which hosts are located,based on thermal analysis components of ANSYS. Different ways are constructed whiletemperature and volume of air flow supplied by air conditioning are selected asindependent variables. Simulation results show that minimum value range of cabinet hotspots temperature (dependent variable) exists. The typical characteristics of cold aislecapping IDC room is that hot spot temperature has linear relationship with the air flowtemperature of air conditioning while it has nonlinear relationship with the air flow volume.Comparison and validation of the first two of the three mainstream heat dissipation waysare involved in the work.