One Kind Of High-power LED Packaged High-heat Dissipation Substrate Structures

Compared with the traditional light source,LED lighting has the advantages of small size,long service life,environmental protection and so on,and has become the most promising light source at present.However,with the continuous improvement of LED power density,heat dissipation has become the main technical bottleneck restricting the development of high-power LED devices.If the heat cannot be emitted when it is extremely high,it will seriously affect the service life,luminous flux and light emitting efficiency of the LED.This paper studies the heat dissipation technology of high-power LED lighting devices and finds that the insulation layer in the package substrate is the main reason to limit the heat dissipation of LED chips.In view of the difficulty of LED heat dissipation,this paper proposes a high heat dissipation substrate structure for high-power LED package.The main research contents are as follows:(1)The LED heat dissipation channel is optimized so that the heat generated by the chip is not directly dissipated to the surrounding environment through the insulation layer with poor heat conductivity,and a design scheme of high heat dissipation substrate is proposed.Compared with the traditional substrate,a layer of insulation layer with high thermal resistance is missing,the heat of the chip can be dissipated more quickly,and the separation of the conductive channel and the conductive channel is also realized.(2)The choice of composite board(copper,aluminum)instead of single metal material for the metal substrate not only improves the heat dissipation performance,but also improves the traditional connection mode of the substrate with lamp beads and radiators,replacing the traditional connection mode with bolts and polymer adhesives by welding,thus further optimizing the heat dissipation path.(3)Through ANSYS thermal simulation,the thermal conductivity of traditional substrate and high heat dissipation substrate is compared.When thermal simulation is performed on 1/4 LED's,the thermal resistance of the package structure with high heat dissipation substrate is 72.39%lower than that of the traditional heat dissipation substrate.When thermal simulation is carried out on multiple LEDs,the thermal resistance is reduced by 17.4%.