Embedded Image Processing System Hardware Design For IC Package Equipment

IC (integrated circuit) industry is one of the basic and strategic industries of thenational economy for China, and the level of technology and industry of IC is animportant symbol of a national science and technology, industry and national defensestrength. IC packaging equipment is the important IC manufacturing equipment, thetechnology level of which directly affects the development trend of IC industry. Atpresent, our country has gradually become the global IC manufacture center, and hasachieved rapid development of technology in the field of IC packaging. However,comparing with the United States, Japan, Korea, Europe and other major IC packagingequipment production countries, our country has not yet been fully master all of keytechnologies of IC package equipment.The machine vision inspection and measurement technology has become the coretechnology of IC packaging equipment, and directly affects the performance of the ICpackage equipment. Now, the development trend of IC packaging appears miniaturization,high speed and density, and the traditional vision system cannot be able to meet thedemand of development of IC package equipment. Thus, the development of low cost,high speed and high precision embedded vision system has become a key and importanttechnology of high-performance IC package equipment.In order to overcome the technical problems of high-speed vision inspection andmeasurement of IC package equipment, this study introduces an embedded visionhardware system design. The content of this study are as follows: the function demandanalysis, the system design of embedded vision, the selection of hardware chips, thedesign of hardware circuit of embedded vision, PCB design plate of embedded vision,and the realization of image processing algorithm by using FPGA hardware circuit andDSP. The principle diagram of the hardware design including: design of Camera-Linkimage data acquisition interface circuit principle diagram, design of the FPGA acquisitioncircuit, design of FPGA system JTAG FLASH circuit and CLOCK circuit, design ofFPGA system and DDR3circuit, design of EMIF interface circuit, design of FPGA and DSP high-speed communications, etc.The contributions of this study consists of the realization of embedded high-speedimage processing by a multi-core DSP6678and FPGA, the image preprocessing by usingFPGA and DSP, and high-speed signal communication between DSP and FPGA by usingSRIO.