Thermal Management Of High Power LED

As a typical green lighting technology, LED is currently experiencing rapiddevelopment in terms of indicators and illumination applications. With the continuousimprove of packaging density, the radiating for high power LED (1W and above) hasbecome a serious problem.First, introduces the produce of thermal, the influence of the thermal resistance andJunction temperature, the research status of the LED heat dissipation problems. Use theparallel thermal resistance model to analyze the traditional LED and get the main coolingpath.Analyze the traditional aluminum plate LED by thermal resistance model andnumerical simulation. Based on the analysis of the conduction of heat resistance, thesapphire substrate, insulating layer and heat conductive adhesive occupy most of thethermal resistance. Point out the improvement direction of LED thermal resistance whichis thermoelectric separation, metallurgy connection instead of heat conductive adhesiveconnection and reduce the number of layers. While the influence of transverse thermalresistance is found, and obtain the optimized size, which is4mm, of aluminum base platethrough the numerical simulation.Based on the analysis of the convective thermal resistance, obtain the area requiredfor one watt heat dissipation at different air velocity.The thermal resistance analysis of aluminum plate, DCB base plate and FPCconcluded that silicon base plate and aluminum nitride DCB base plate can be used toreplace aluminum plate. Study the influence of copper foil layer thickness for FPC baseplate to get the best size.At last, the finned heat pipe radiator is used as an example to analyze and optimizefin number and fold height, etc.