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Triaxial Capacitive Accelerometer Based On The Monolithic Integration Of CMOS MEMS

Posted on:2014-12-04Degree:MasterType:Thesis
Country:ChinaCandidate:B M DuanFull Text:PDF
GTID:2268330401988841Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
IC technology and micro-machining technology prepared micro-machinedaccelerometer, with its small size, light weight, low power consumption, low cost,easy of integration, strong anti-overload and mass characteristics has become corecomponents of Micro Inertial Measurement Unit. Capacitive accelerometer due toits low-noise, high-precision, low-power consumption, has been one successfulapplication of micro-machined accelerometers. This paper focuses on the carMEMS sensors project design based on a monolithic CMOS MEMS technologyintegrated multi-layer metal structure three-axis capacitive accelerometer. Specificwork and results are as follows:(1)Comparative analysing the advantages, disadvantages and feasibility ofacceleration sensor of the different kinds of detection principle, choosing thecomb-shaped capacitor structure as the direction of the theme of the thesis;(2)For detection method of comb-type capacitor, designing simultaneouslydetect three axial acceleration of the overall sensor structure, the overall detectionstructure of the sensor comprises: detect the XY-axis mass,detect the Z-axismass,same layer set comb move comb uniform-comb structure XY-axis sensitiveunit, intertwined metal layer Z-axis sensitive unit,support XY-axis mass L-shapedelastic beam,support Z-axis mass elastic beam, anchor point;(3)Simulating and verifying sensor structure overall mechanical properties byusing finite element software, optimizing the sensor size according to the verifiedresults,and getting the horizontal direction and Z-axis mechanical sensitivity andresonance frequency of the sensor;(4)Designing one kind of double carrier low resistance preamplifier detectioncircuit, focusing on the determination of the parameters of the amplifier;;(5)Elaborating on the fabrication steps of preparating sensor by using theCMOS MEMS0.35um TSMC technology;...
Keywords/Search Tags:CMOS MEMS, Monolithic integration, Capacitive, Accelerationsensor, Multi-layer metal
PDF Full Text Request
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