Research On Microwave Passive Circuit Based On SiP Technology

In recent years, with the rapid development of microwave and millimeter wavetechnology, demand for products which are miniaturized, low cost and high reliability isincreasing. The SiP (System in Package) technology uses a multilayer three-dimensionalstructure, which assembles a lot of active electronic devices having different functionsand selectable passive components into a single standard package that can provide avariety of functions.So the SiP technology can not only improve the degree of systemintegration, but also achieve the idea of miniaturization. This paper will discuss thepassive circuit related to the SiP technology.Firstly, this paper focuses on the processing and norms of the multilayertechnology. The designer only understand enough of the relevant processes beforeavoiding mistakes that may arise in the study later. In practice, it will make the jobeasier and greatly reduce the communication time between the designers to unify therelevant parameters.The main transmission lines are microstrip, stripline, and Substrate IntegratedWaveguide in the microwave millimeter wave multilayer. Firstly, here is a belief aboutmicrostrip lines and Substrate Integrated Waveguide, and then modeling and simulation,and proposes some effective methods to reduce the insertion loss.Secondly, we give anemphasis on the signal transmission in multilayer structure, and then model the verticaltransition of a microstrip-stripline-microstrip from the aspect of impedance matchingand field matching, which can be optimized using HFSS software by Combining withthe road and field. At the same time, elaborating a variety of factors that have an impacton the performance of the transition structure, which must be considered in theprocessing. Finally, the simulation results show the good performance of the transition.The embedded technology provides an effective method to reduce the componentsizes. In this paper, two bandpass filters are proposed, which are embedded design toreduce the size of the module in SiP.This paper also discusses the tolerance problems of the passive device in the SiPmultilayer structure. Firstly, here gives an analysis on the processing tolerance. Using the HFSS software scans the multiple combinations of filter parameters. The scatteringparameters of the filter are good enough to the design requirements, therebysubstantially guarantee the performance of the filter. Secondly, we has simplyintroduced the parasitic mode of high-frequency electromagnetic fields, and thenmodeling,simulation and optimization. By placing metallized hole in proper point andchanging the cavity size, we can effectively avoid the spurious mode having a badeffect on the passive circuit.