| Integrated power electronic modules eased power electronics technology applications in a variety of contradictions. However, with the increasing integration density, power electronics module integrated heat flux density is also increasing, efficient cooling of power electronics integrated main technical bottlenecks.In order to better overcome the power electronics integrated heat during this major technical problem, this paper presents a micro-channel liquid-cooled substrate with two directions, which can be arranged in two-sided power electronic chips; micro-channel is trapezoidal cross-section having a pair of fins array formed of high heat transfer coefficient such a structure, the pressure loss is small, easy to wash after obstruction; conducted with double trapezoidal cross-section ribs prototype array; i.e. the length dimension of the substrate D (x-direction), width (y-direction) dimension has been set on the premise, the substrate has six variable parameters:fin spacing, fin height, fin-entrance base width, the bottom width of the fins inlet, outlet bottom width rib, rib exit bottom width. By experimental design, the various structural parameters of numerical simulation and parameter optimization to find the heat transfer coefficient, pressure loss and variable parameters general rule, under which the heat transfer coefficient and export base width, fin height, fin spacing three parameters have a significant non-linear relationship with the inlet pressure loss under the bottom width, bottom width of the exit, exit on the bottom width, fin spacing, fin parameters were significantly higher nonlinear relationship. Liquid-cooled substrate export, import segment structure have a significant impact on its performance. This detailed study of this effect, and gives a better design of the portal structure.This simulation study for subsequent experimental research work has laid a solid foundation. |
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