| A variety of contradictions in power electronics technology applications are solved by the integrated power electronics module (IPEM). However, with the increase of integration density, the thermal density of IPEM is increasing too, which becomes one of the main bottlenecks to the development of this field.In order to better overcome the heating problem which is the main technical problem in the integration of power electronic elements, in this paper, a micro-channel liquid-cooled DBC substrate is proposed in which small heat conduction and turbulence components are set for efficient cooling and the basic study on its application is underway. Two kinds of better performance fin arrays are studied. One is the fin arrays which could form the Moire fringe effect and the other is the one that has double-trapezoidal section. By the method of simulation, internal structure of the IPEM which could form the Moire fringe effect is studied as well as the effect to micro-channel heat exchange when parameters change. There are four important parameters to this micro-channel structure, fin angle, fin thickness, fin height and fin thickness. Numerical simulation and parameter optimization were done to these parameters. The general rules are identified and the comprehensive treatment method of the four parameters is given in this paper. Combining with the work of the other members of the research group, the testing platform of the IPEM micro-channel liquid-cooling substrate is built up and corresponding test is done.The research to the thermal control of the IPEM is one of the main research directions in the field of power electronics. The thermal structure model proposed in this paper and the optimization to the structural parameters will lay a foundation for the follow-up work. The testing method and the rule found in the process of parameter optimization will be application in the field of thermal control. |
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