Technology Of Failure Components Detection In High-density Circuit Board Based On Eletromagic Scanning

It is increasingly difficult to assemble the high-density circuit boards and thequality of them declines a lot, because they possess the properties of high density, highfrequency and high reliability. Meanwhile, traditional detection methods cannot adapt tothe assemble testing requirements of these high-density circuit board. This paper usesthe technology of electromagnetic scanning to detect the high-density circuit board. Themost important problem of it is to judge the abnormal area and detect the suspectedfailure components, which has both important study of meaning and significant researchvalue.The Detection technology of high-density circuit board based on electromagneticscanning technology is designed and implemented in this paper. This paper makes adetailed study of the detection method of anomalous area in the high-density circuit. Animage extraction algorithm based on color is proposed, and use it to extract the effectivearea from the cloud image obtaining the effective area image. Meanwhile, differenceimage is improved, and using the improved algorithm to compare the effective image ofthe standard PCB with that of the test PCB, obtaining the cloud difference image.Besides, the anomalous areas of high-density circuit board are obtained by employingthreshold value method and RGB color model. In addition, using OpenCV technologyto process the anomalous area, the position coordinates are obtained, which provide datafor the judgment of the suspected failure components. Models for components are built,and a judgment algorithm for suspected failure components detection is designed,completing the judgment of the suspected failure components.Theoretical analysis and experimental results show that it is feasible and effectiveto introduce electromagnetic scanning technology into detection of the high-densitycircuit board. Moreover, the algorithm which is proposed in this paper is both accurateand efficient.In the following research work, it is necessary to optimize testing process of thewhole high-density circuit. Meanwhile, the time complexity of detection suspectedfailure components should be reduced and the accuracy of it should be improved.