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The Micro System Based On Tsv Adapter Plate Design Software And Its Test Method Research

Posted on:2014-01-04Degree:MasterType:Thesis
Country:ChinaCandidate:Y Z LvFull Text:PDF
GTID:2248330392958594Subject:Instrumentation engineering
Abstract/Summary:PDF Full Text Request
With people’s demand for electronic products continues to increase, themicroelectronic package is developing towards miniaturization, high speed, highdensity and systematization. System in package (SIP) as mainstream technology ofsystem integration, will become the inevitable development trend of the electronicindustry. Through silicon via (TSV) can provide efficient interconnection for SIP by avertical route, so TSV has become an important part in the research of SIP.The current software environment of SIP design is relatively backward. Most ofthe designers choose HFSS, Cadence and other simulation softwares when drawingand simulating TSV model. These software have excellent simulation effect, however,they have not easy modeling, operating difficulties and other shortcomings. In view ofthe above, the graduation design develops Interposer Designer software, othermoretries to test TSV and obtain the I-V characteristic curve using NI PXI chassis, thusrealizes the integration of design and test.This paper presents an algorithm to get the point corresponding relationship ofthe screen coordinate system and OpenGL vision coordinate system, describes theapplication of this algorithm to draw2D and3D basic geometries, and explains thealgorithm and realization way of the common geometry operating functions. Thispaper focuses on the interposer model drawing method, equivalent circuit model andits RLC parameters calculation, othermore the interposer model simulation and save.Simulation includes circuit simulation and electromagnetic simulation, circuitsimulation through the external interface called HSPICE software to finish,electromagnetic simulation through the external interface called HFSS software tofinish. The model save contains CSV and SP file formats. This paper also brieflyintroduces NI PXI chassis, and design the process of testing TSV using NI PXIchassis. The test method is described in detail. The software part of testing which isprogrammed by LabView is given.
Keywords/Search Tags:system in package, interposer, through silicon via, RLC parameters, VC, OpenGL
PDF Full Text Request
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