Investigation Of Micro Laser Polishing On Surface Of The Part Sintered By Selective Laser Micro Sintering

The Selective Laser micro Sintering(μ-SLS) which is developed from Selective LaserSintering(SLS) can conveniently manufacture micro metal mold from metal powders and theCAD model. It is necessary to polish the surface of micro metal mold because of the badaccuracy and surface roughness of the μ-SLS. This paper takes the new technology of Lasermicro Polishing(μ-LP)to polish the metal parts surface of μ-SLS. First it describes thedomestic and international dynamics of laser polishing. Then studies on μ-LP and gets somevaluable results according from the characteristics of the metal parts surface of μ-SLS asfollows:(1) Several possible programs of μ-LP are investigated on the basis of: remelting、scanning thin powder-bed and remelting after the scanning thin powder-bed. The results ofthese three methods have been compared and the optimum method is obtained. That issannning thin powder-bed: spreading a thin metal powder layer on the sample and polishingit by μ-LP. In this way，the original roughness Ra18.533μm reduces to12.152μm, decreasedby34.4%.(2) The effect of parameters and sample size for μ-LP is studied. It concludes theparameters have great influence on μ-LP and gets the best parameters.(3)Non Significant difference can be found by using continuous wave laser and pulsedlaser. The best result is still based on the optimal process parameters.(4) Finally, the paper also proposed a modified program: preheating samples, coolinggently, improving the scratch powder process and rescanning.