The Research Of Dry Etch Chamber Parts Effect The Process Condition And How To Control

Dry etching process is mainly responsible for graphics conversion process in the semiconductor。For the narrow width process,the chamber condition and defect condition is key factor and difficult for control. Following the 90nm products, all of the requirements have increased, the ignored small defects will affect the yields in high technology . Original acceptable chamber condition changes now can not meet the requirements. In this article, We focus on the research of different chamber parts condition impact the process condition. Find out the key indicators to determine what kind of situation will affect chamber condition and impact the final yield. Such as pressure, temperature, gas flow and radio frequency power. Detail list these important factor’s effects on process condition.At the first ,we introduced the key parts in chamber and the key components of these key parts, as well as the impact on the process.Chamber Liner coating thickness,coating type and roughness have a direct impact on the process conditions. ESC as the wafer temperature control unit determines the quality of silicon wafer temperature. Insert ring is important for wafer uniformity control in the 12-inch etching. The key components of these parameters will directly affect the process, through the understanding of the impact of these relations, we can find some index for control the state of these parts. Detail analysis the root cause of the production issue to find the control method for key parts of chamber. So that each product can be a very good control of the chamber in production. Improve the process stability and performance.Then get high-quality products.This article introduce dry etching principle, the key parameters of the process and the dry etching equipment. Understanding the basic correlation . Through some research on the production issue,find out the rootcause and failure modle. Summarize the some key factors and key parameters to improve the yield of the product .Provided a good way for yield contral.Through some DOE’s experiment to find a way to control these parameters. Research on parts material, size, surface coatings ,coating materials ,thickness of the coating and surface roughness. And has the application case share in the article to verify our idea.