Font Size: a A A

Theoretical And Experimental Research On Devices With The Silicon-based Microcavity

Posted on:2012-05-21Degree:MasterType:Thesis
Country:ChinaCandidate:T N YuanFull Text:PDF
GTID:2248330392456260Subject:Physical Electronics
Abstract/Summary:PDF Full Text Request
Fueled by the predicted saturation of “Moore’s Law”, universities and industriesfromall over the world are exploring the possibilities of creating truly integratedsiliconopto-electronic devices. Some of the most promising siliconphotonicstechnologies are chip-to-chip and intra-chip optical interconnects. The limiting factorinthe widespread adoption of optical interconnects is the lack of practical on-chipopticalsources. Unfortunately, crystalline silicon is widely known as a pooremitterbecause of its indirect bandgap.Using the micro cavity structure production of laserresonant cavity, we can get high silicon based hybrid integrated light source by bondingthe silicon-based optical waveguide and the III-Vmicro disk laser together.This thesis studies the characteristics of thesilicon-based micro-cavity, buildstheoptical fiber coupling measurement system, and explores the silicon-based bondingprocess. Some results are obtained as following:(1)The basic theories and the characteristics of the silicon-basedmicrodisk areintroduced. By numerical analysis method, we can get the effective refractive indexcurve and the dispersion program of the microdisk, and compare the mode characteristicsand performance parameters of microdisk with different radius. Based on the abovetheories, we simulate the surface plasma microdisk, calculate its Q value, and compare itwith the silicon-based microdisk.(2)After introducingthe basic principle of the fiber coupling test system, we test theSOI microring.Through the test, we can get the efficiency of the grating coupler is39%.We build the test automation system, and use it to test the microring. At last, we obtainthe resonant spectrum of the microring.The FSR of the microring is3nm, and thecorresponding Q value is about8000.(3)The basic principle of the silicon-based bonding process was introduced, and thecommonly used several bonding technology was compared. Then, we do the processingof the BCB bonding. Optical characteristics, bonding strength and surface smoothness ofthe BCB are measured.
Keywords/Search Tags:Silicon Photonics, Micro-cavity, Vertical coupling, Bonding
PDF Full Text Request
Related items