Broadband Frequency Source Miniaturization And Integration Of Packaging Research

Frequency source provides a large number of the high stable and accurate standardfrequency signal. It will influence performance of the electronic system as a heart ofcommunication system, radar, apparatus, spaceflight, TV and so on. The wide-bandfrequency source can cover with more system information, improve the ability ofanti-jamming, and its miniature design is researching focus in the future.Relying on SIP Engineering Center in Sichuan Province Research Institute ofElectronic Science and Technology of UESTC, the miniaturization and integrationpackage of a wide-band and high-performance frequency source are studied using lowtemperature ceramic co-fired (LTCC) technology and integrated packaging technology.The main contents and research results are as following:1. The wide-band technology of the wide-band frequency is studied, and thescheme which combines phase-locked frequency synthesizer technology (PLL)frequency synthesis technology with multiple comprehensive technology is chosen inthis paper. This paper completed the circuit design of the wide-band frequency source,which mainly includes C-band wide-band voltage controlled oscillator (VCO) design,key chip choice, circuit wiring, etc, verifying the feasibility of the design scheme.2. Realized wide-band frequency source miniaturization design using LTCCtechnology. Researched and analyzed the key techniques such as the embedded passivecomponents in LTCC, inter-layer interconnect technology, integrated packagingtechnology, thermal control technology. Optimized designed the miniaturization3Dintegration package structure.3. The wide-band miniature frequency source with3D integrated package in LTCCis completed, and test results are provided and analyzed. The size of the final physicalmodule is given as12mm×12mm×3.7mm. And compared to the traditional hybridintegrated circuit, the area is reduced by81%.