The Research On High-Speed PCB Power Integrity

With the rapid development of electronic technology, electronic products make progress towards lightweight, miniaturization and multi-functional, high reliability and high integration, while the package of semiconductor device also advances on fine pitchand, multi-pin and surface-mount. Accordingly, the PCB, used for the various components’support and interconnection, makes progress towards small, high-density and high-speed. The coming challenges brought by the complexity of its design is increasing, and the pressure to manufacturers that products faced to market have too short production cycle are also growing. In the design, in addition to the requirements of the signal integrity analysis, the question how to provide a stable and reliable power has become one of the key research directions. With the increasing demand for high-speed electronic system design simulation accuracy, it is assumed that the supply voltage and the corresponding ground potential is not completely in a steady state has been more and more attention. The effect from power ripple should not be ignored.As a result, the research on power integrity comes into being.Power Distribution Network is the basic structure of the power integrity. Firstly, starting from the power distribution network, analyzes the characteristics of power distribution network model and its role. Then the introduction of the cause of the power integrity problem, the problem is switching noisea problem, analysis of the more common methods of analysis in the industry about power integrity issues in detail---the target impedance method.Make a reference base on an actual power integrity analysis case, in this article, discuss two issues based on the high-speed PCB, one is power integrity simulation models choosen and the other is determination of the standard identification. Simulate with the target impendence method, problem, summary the PCB improve advance accoding the simulation results. From the two important aspects of the PCB layout, placement of filter capacitors and different values of capacitors, analysis the high-speed PCB board level power integrity solutions. Obtained through the comparison of test results meet the design requirements of the power supply PCB board-level design, to improve the stability of the PCB board-level power, shorten the design cycle, saving the cost of the design.Finally, the article summarizes the high-speed PCB board-level power integrity issues, given effective power supply layout and routing rules, theoretical guidance for the practical significance of the actual project. In additional, we want to clarify that any simulation work must be connected with test work. The simulation work is to provide for the practical work of reference on the direction of a theory and research, not a substitute for the actual work, only the simulated and measured a combination, constantly sum up, in order to gain some valuable experience in the actual work to be effective.