High Integration Substrate Integrated Waveguide Passive Components

In recent years, microwave and millimeter wave circuit system towards a high level of integration and miniaturization trend, so the single components of the high-performance, miniaturization has become the focus of attention of many scholars. Basically, early circuit is a cavity or micro-strip structure, but the traditional transmission line structural has unavoidable defects in the circuit design. In many areas, the traditional transmission line no longer meets the circuit design requirements, Therefore, a new transmission structure-Substrate Integrated Waveguide (SIW) has become a hot research. SIW integrated the both advantages of a metal waveguide and conventional planar circuit, so SIW circuit can get better result. But, SIW need to solve the primary problem is still small structure size.In this dissertation, the folded SIW, dual-mode SIW, multilayer SIW, are used to achieve the miniaturization of microwave components design. Firstly, based on the principle of the folded cavity, designed a variety of new structural miniaturization SIW cavity, and achieved a high degree of miniaturization substrate integrated waveguide cavity. With the same resonant frequency, the area can be reduced to1/18. Secondly, based on the miniaturization SIW cavity, two novel structures of the substrate integrated waveguide band-pass filter have been designed. Their size is drastically reduced. Thirdly, based on the dual principles, designed many dual-mode SIW components in engineering applications, including filter, filtering power divider, and diplexer. Meeting performance indications at the same time, they achieved the purpose of miniaturization. Finally, according to the principle of multi-layer circuit, a four-layer SIW Butler matrix can be designed, mainly by increasing the number of the circuit layers to decrease the plane size.