Design And Optimization Of High-power IGBT Heat Sink

With the rapid development of modern electronic technology, power electronics products’ heat flux is growing, the volume is continued to be narrow. The rising temperature of the center of the IGBT affects the reliability of electronic equipment, so the electronics cooling technology requirements more stringent.This paper studies the development of electronic device’s thermal design and thermal simulation technology at home and abroad, and the main problems of the current state of the thermal simulation technology facing. On the basis of this, using computer simulation software to build a computer model of the original products and sets the boundary conditions according to the actual electronic devices and the heat sink’s temperature measured and dimensions. And comparing simulation results with measured data, in order to verify the simulation model and boundary conditions whether reasonable and accurate or not.On the basis of the established model, by changing the radiator fin height, thickness and the number, get the temperature field and velocity field, analysis the influence of various factors. Compare and explore the best geometry of radiator fins, using the thermal test to verify the optimization results. By changing the fan flow, this paper studies the influence on heat. According to the distribution of temperature and velocity inside the chassis, explore the optimal amount of wind turbines.Take the analytical method, software analysis and parametric analysis of variance in three different ways optimization, optimization factors and results were compared to analyze the pros and cons of various methods and their applicability,and get the best heat sink structure and operating parameters.