Driver Ic (cof), Failure Analysis And Countermeasures

Changes in the electronics industry innovations are launched around the IC process technology. It is based on the full development of the existing potential rather than the discovery of new laws of physics. We need to fully use the current resources, and also have to work harder in order to make progress.I'm working in a LCD TV company. We will purchase Drive IC (COF) and use them in our production line. My responsibility is to control COF manufactory. Nowadays COF is the main package type of Drive IC, or all the Drive IC mentioned in this topic mainly means COF. In the course of the working, we faced a lot of problem of COF. This topic will follow 3 parts of the investigation and study as below, and then we will carry out the process improvements to promote the "Pass" ratio and make cost down.Investigation and Study for Pin short caused by particleThis topic appointed out which process is easy to produce particle. After investigation, it showed the life of UV tape, Pick-up Collet and Conductive Rubber. The effective action will give a good suggestion to the factories who have similar process.Investigation and Study for bent on the filmThis topic not only gave an effective action for the defect, but also tells us the difference of TAB and COF. To avoid the risk, we have to do some action for the different products, though they are really similar.Investigation and Study for short caused by conductive particle of ACF in bonding processThis topic did 2 further investigations in this project:the relationship between the collection of conductive particle and the affective from the edge of solder mask and the edge of glass; the collection of conductive particle and the transformer of PI caused by pressure. To utilize ACF better, we have to have a good knowledge of ACF. Thus we can take the advantage and avoid the defect.The long-term signification of this topic is that hope of assisting in the production of COF maker and COF user to gain some insight and optimize the process. When they facing the similar problems, they can find the solutions and solve them in a short time. And according to the factors discussed under this topic, from product design stage, through COF process stage to COF application stage, they can take some effective actions and make the high quality.