| The research presented in this thesis focuses on the incorporation of partial prior knowledge into fuzzy models. Fuzzy models with Takagi-Sugeno rules were chosen because of the ease with which partial knowledge can be included in these models. Two reasons for the incorporation of partial knowledge are highlighted. First, partial knowledge can be used to improve the global accuracy of empirical models when only impoverished example data sets are available. Second, partial knowledge can be used to improve the success of model transfer efforts. Model transfer refers to the act of adjusting a model that was previously identified for one task so that it can be used for a new, similar task.; In order to study and demonstrate some of the modeling and model transfer concepts, both simulated and experimental data are used. The experimental data were obtained during the course of an experimental study of the thermosonic flip-chip, bonding process. This process is complex, noisy, and highly non-linear. Furthermore, the physical mechanisms that control this process are not fully understood. Because of these issues, this process is particularly well suited to demonstrating concepts related to the inclusion of partial knowledge and the use of model transfer techniques. It is important to note here that the focus of the experimental work was on mechanics aspects of the thermosonic bonding process, although materials issues also play a significant role.; The primary contributions of this work are related to the study of the fuzzy logic based regression models and their application to model transfer problems. This is not the first use of these models, but it may be the most comprehensive study of the use of partial knowledge with them. Included in this study is the development of four different model transfer methods.; Secondary contributions include the development and fabrication of a new longitudinal thermosonic flip-chip bonding machine and die pull testing apparatus, the experimental study of the effect of bonding time and power on thermosonic flip-chip bond strength and the demonstration of a repeatable bonding process that results in high bond strength. |
