Power Integrated With 0.35 Micron Bcd Process

BCD technology is one of the most important technologies for power integration.It was invented by ST microelectronics in 1980S.After more than twenty years development,BCD technology spins to three branches: high voltage BCD,High power BCD and High density BCD.In this paper, 0.35um BCD technology will be as an example for detail description and technology considerations with the experience of the research and development of BCD technology in HHNEC.The main discussions are reliability,SOA and Rsp-BVdss trade off in this paper under a low cost process flow design.In the last twenty years,BCD technology is totally held by international famous IDM company.I clearly indentify the electric field improvement for device use TCAD simulation software to improve the reliability and safe operation area,too.The platform is designed with module style and all options can be selective base on customer's requirement with low process cost,then we got the competitive with low cost and high technology performance 0.35um BCD platform.We made the product base on BCD technology in our country,at the same time,this platform provides baseline for national 02 special 0.18um BCD project.