Study Of The Thermal Design Of The Multi-function Integrated Structure Of The Module

With the use of electronic technology, the equipment's function, size, weight, reliability and the various environmental adaptability are incorporated into the structural design. In order to meet the technical demands of new generation avionics systems'requirements of integration, modularization, miniaturization, high reliability and high maintenance, design and do research of multi-function integrated module are put on the agenda.The design about the Multifunction integrated structures module is a multi-interdisciplinary study, which involves thermal design, vibration design, electromagnetic compatibility design and circuit design. The multi-functional integrated module structure is designed mainly from the thermal technology. Cold plate of the module is designed by using thermal conduction and forced liquid cooling technology as major heat control methods.Existing foreign standards about LRM are described. VITA48 is chose to be the main reference with comparing the standards. The structure design of module and parts are completed by synthesizing the existing technology and research results.In the chapter of thermal model, thermal of components and modules is analyzed. Compact Thermal Models of the important parts and the module are established with thermal resistance network method. The main thermal resistance parameters of heat dissipation are discussed to provide the thermal simulation necessary data.In the chapter of the module thermal simulation study, the general thermal simulation process is introduced. The ratio of height to width of cold plate fin is analyzed and parameter of the cold plate is optimized.Methods of thermal test are introduced. The thermal resistance of Wedge lock is tested by contact measurement method. The equivalent thermal model is established by test and emulation studies which provide the necessary data to establish module and system model. At the same time, the average heat exchange coefficient and the pressure loss of the cold plate have been tested. The module design method,thermal resistance model method,thermal emulation analysis method and thermal test method can be used for thermal design of military and civilian electronic equipment.